The main purpose of SMT chip processing is to accurately mount the surface mount components to the PCB. In the process of chip mounting, some process problems sometimes occur, affecting the quality of the chip, such as the displacement of components. Patch processing occurs in the components of the shift is the component plate in the welding process a number of other problems foreshadowed, need attention. So chip processing components in the shift is what is the reason? The following hundred and thousands of chip processing manufacturers for everyone to analyze.

Chip processing components shift causes:

1, the use of solder paste is limited, beyond the period of use, resulting in the deterioration of the flux, poor welding.

2, the viscosity of solder paste itself is not enough, the components in the handling of oscillation, shaking and other issues caused by the shift components.

3, solder paste flux content is too high, too much flux in the reflow process led to the flow of components.

4, components in the printing, chip handling process due to vibration or incorrect handling caused the components shift.

5, chip processing, nozzle pressure is not adjusted, the pressure is not enough, resulting in components shift.

6, Mounter itself mechanical problems caused by the components placed in the wrong place.

Chip processing in the event of components shift, it will affect the circuit board performance, so in the process of processing components need to understand the reasons for the shift, and targeted to solve.