SMT chip processing in today's boom in electronic products started more and more known, SMT chip processing technology subsequently attracted a lot of curiosity and strong friends, Jingbang Xiaobian will be detailed in this article Example SMT chip processing all the processes, I hope for your help.

1. Single-sided assembly: incoming inspection + screen printing + solder paste (red plastic) + patch + reflow (curing) + cleaning + testing + rework

2. Single-sided mixed: incoming inspection PCB PCB A-side screen printing paste (red plastic) + patch + A surface reflow (curing) + cleaning + plug-in + peak + cleaning + testing + rework

3. Double-sided assembly: incoming inspection + PCB A side silk screen solder paste + patch + A side reflow (curing) + cleaning + flap + B side screen printing solder paste (red plastic) + patch + B surface reflow (curing) or (DIP + crest) + cleaning + testing + rework

4. Double-sided mixed: incoming inspection + B side of the PCB screen printing paste (red plastic) + patch + B side reflow (curing) + cleaning + flap + A side screen printing paste (red plastic) + patch + B surface reflow (curing) or (DIP + peak) + cleaning + testing + rework

5 silk screen: its role is to solder paste or patch glue printed on the PCB pad, in preparation for the welding of components. Equipment used for screen printing machine (screen printing machine), located in the forefront of the SMT production line.

6. Dispensing: It is the glue drops to the PCB's fixed position, its main role is to fix the components to the PCB board. The equipment used is a dispenser, located at the forefront of the SMT line or behind the test equipment.

7. Placement: Its role is to accurately mount the surface assembly components to a fixed position on the PCB. Equipment used for the placement machine, located in the SMT production line in the back of the screen printing machine.

8. Curing: Its role is to melt the chip glue, so that the surface assembly of components and PCB firmly bonded together. The equipment used is a curing oven, located behind the placement machine in the SMT line.

9. Reflow soldering: Its role is to melt the solder paste, so that the surface assembly components and PCB firmly bonded together. The equipment used is a reflow oven located on the back of the SMT machine in the placement machine.

10. Cleaning: Its role is to be assembled on the PCB board harmful to the human body, such as welding residues removed flux. Equipment used for washing machines, the location can not be fixed, can be online or offline.

11. Detection: Its role is to assemble the PCB board welding quality and assembly quality testing. Equipment used are magnifying glass, microscope, on-line tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY testing system, functional tester. Location According to the testing needs, can be configured in the production line where appropriate.

12. Rework: Its role is to detect failed PCB rework. Tools used for the iron, rework station and so on. Configured anywhere in the production line.